5050 RGBW LED
Product Specifications:
| Product Name | 5050 RGBW LED Chip |
| LED type | 4-in-1 5050 SMD LED |
| Emitting Color | RGB+Cool White, RGB+Nature White, RGB+Warm White |
| Voltage | DC5V |
| Gray Scale | 256 |
| Moisture-proof grade | LEVEL5a |
| Certification: | CE, EMC, FCC, LVD, RoHS |
Application:
(1) Signal Light Engine
(2) Commercial Display
(3) Industrial Light Engine
(4) Indoor/Outdoor/Decoration
Detail of LED Chip
6.Shipping:
Shipping port: Shenzhen, Mainland China.
Ship way: Door to Door express, by air or sea.
lead time: normally in 7-10days, after receiving the payment.
Sample policy: samples are available, which can be delivered in 3-5days once payment received.
7.Warranty:
We offer 2 or 3 years Warranty.
Our products with good quality and have been tested before shipment.
8.Our Services:
Fast response to your inquiry and feedback..
Strict quality control and testing before delivery.
Well-trained and experienced staffs to answer all your enquire.
Customized design,ODM/OEM Customized Service are available.
Professional after-sales service and 24 hours online at your service.
Q: What certificate you can offer?
A: Usually CE and RoHs,others UL certification we can offer too based on your need.
Q: What payment way you accept?
A:If you need any led products, you can send us the email or inquiry, then we will answer you in time and send you PI with payment way, we are the factory not trade company, so we need to produce according to each order for you.
Q: What is your MOQ of led strip and led chip?
A:The MOQ of LED Strip usually 10meters, and the MOQ of led chip usually 1reel SPQ. We also can send the free sample led chip for customer to test if they have them in stock.
Q: Does all the products designed by yourself?
A:Yes, our boss is also an engineer and we have more than 10 years experienced engineer team, all the led products designed by ourselves.
The traditional LED chip adopts the front mounting structure, which is usually coated with a layer of epoxy resin and sapphire as the substrate. On the one hand, due to the poor thermal conductivity of sapphire, the heat generated by the active layer can not be released in time, and the sapphire substrate will absorb the light from the active region, even adding a metal reflector can not completely solve the problem of absorption; On the other hand, due to the poor thermal conductivity of epoxy resin, the heat can only be dissipated by the pins under the chip. Therefore, both the front and the back cause heat dissipation problems, which affect the performance and reliability of the device. In view of this, led flip chip welding technology came into being.
